Results

Final report



 

    Plasma chemical etching for c-Si photovoltaics
    Structuring of TCO layers for TF-Photovoltaics
    Infection control – Process and materials studies
    Application demonstrator for infection control
    Energy storage – Process and materials R&D
    Application demonstrator for energy storage
    Interface technologies for durable adhesion
    Application demonstrator for interface technologies
    Cross-cutting equipment development

 

Application demonstrator for interface technologies

Polypropylene plasma modification with IWS mask in front
© Fraunhofer IWS

 

DBD plasma source
© Vito

 

Deposition of SiOxCy layer on embossed steel plate (INOX 304, bright-annealed) by extended DC-Arc plasma technology (Fraunhofer IWS); sample size: 15 cm x 30 cm
© Fraunhofer IWS

 

Application demonstrator

  • transfer of results from small flat laboratory samples to 3D shaped components or flat coils with high processing speed in industrially relevant scale
  • equipment demonstrator for functionalising and coating of components:
    • robot-conform technology head to be used for coating of immobile big parts for aeronautics & automotive industry
    • coating system for flat steel coils at high speed for steel industry

 

Aeronautic application: adhesive bonding of CRP and Titanium

  • increased life-time of bonds
  • substitution of handcraft by automated equipment

 

Automotive application: adhesion of paints on thermoplastic materials

  • reduction of failure rate
  • cost reduction by application of not adhesion optimized plastic material

 

Steel industry: adhesion on stainless steel and pre-painted steel

  • increase of adhesion strength for e.g. sandwich panel for construction (steel skin + lightweight core)

 

Technology head being mounted in a test bench with DC arc plasma source

  • adhesion and durability of Titanium bonds in the same range as the adhesion demonstrated using the laboratory coater head device
  • adhesively bonded CFRP test specimen show a failure in the substrate which indicates higher bond strength of the interface than the cohesion of the substrate
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