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Application demonstrator aeronautics, bonding of U-shaped components Ti (inner side) to CFRP (outer side)
© EADS
Deposition of SiOxCy layer on embossed steel plate (INOX 304, bright-annealed) by extended DC-Arc plasma technology (FhG-IWS); sample size: 15 cm x 30 cm
© Fraunhofer IWS
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Overview of results
Plasma chemical etching for c-Si photovoltaics
Structuring of TCO layers for TF-Photovoltaics
Infection control – Process and materials studies
Application demonstrator for infection control
Energy storage – Process and materials R&D
Application demonstrator for energy storage
Interface technologies for durable adhesion
Application demonstrator for interface technologies
Cross-cutting equipment development
Integration
A key aspect of this “Integrating Project” is the potential benefit from cooperation cross-over boundaries of traditional areas. Whilst we have focused the R&D activities along the four “Impact Areas” being selected, we have established strong horizontal “cross-cutting” technology links based on the underpinning technologies for high throughput manufacturing.
Horizontal technology platforms to support “cross fertilisation” have been established in:
- atmospheric pressure CVD technologies
- atmospheric pressure plasmas
- etching and nucleation for 3D nano-structuring
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surface analysis of 3D nano-structures including on-line technologies
- process monitoring & control, quality assessment.
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